| Important Notice | |
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| 13:00 - 13:10 | Welcome Remarks |
| 13:10 - 13:40 |
Deployment of 5G RF FEM (Front-End-Module) within Interoperable Simulation Platform
- Sharon Chen, Solutions Engineer, Keysight
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| 13:40 - 14:20 |
Pioneering the Future of Sub-THz Communications: Cutting-edge Measurement Solution for PA and Dual-Band MIMO System
- Sam Kusano, Master Apps Engineer, Keysight
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| 14:20 - 15:00 |
The Importance of Accurate Raw Materials Measurement and Correct Methodology Use
- Say Phommakesone, High-Frequency Component Characterization Solution Manager, Keysight
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| 15:00 - 15:20 | Coffee Break & Booth Tour |
| 15:20 - 16:00 |
Characterization of WBG Power Modules, Device Modeling, and Circuit Simulation
- Jay Liao, Solutions Engineer, Keysight
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| 16:00 - 16:30 |
The High-Speed 224Gb/s PAM4 Interconnection Solution
- Tony Chen, SI Senior Engineer, Samtec
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| 16:30 - 17:00 |
5G and 6G On-wafer Measurements Advancements
- Gavin Fisher, Sr. Staff Applications Specialist, FormFactor
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| 17:00 - 17:30 |
Advancing 5G/6G: Innovative Approaches in Wafer-Level mmW Calibration and Characterization
- Dr. Andrej Rumiantsev, Director of RF Technologies, MPI Corporation
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| 17:30 - 17:40 | Lucky Draw and Wrap-up |
